world's first factory to mass-produce glass substrates — a direct alternative to TSMC's packaging platform. In January 2026, Intel debuted the first sample co

world's first factory to mass-produce glass substrates — a direct alternative to TSMC's packaging platform. In January 2026, Intel debuted the first sample combining its bridge packaging with a glass core substrate — crack-free — at a trade show in Japan. Partnering with AUO adds display-industry…