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Microsoft is reportedly in talks with TSMC to secure capacity for more than 300,000 Maia 300 AI chips in 2027. The reported plan to lift output to about 1 milli

BWB News TV • 2026-08-10 13:31 UTC • By Billy Odell Tucker-Robinson
Microsoft is reportedly in talks with TSMC to secure capacity for more than 300,000 Maia 300 AI chips in 2027. The reported plan to lift output to about 1 milli
Microsoft is reportedly in talks with TSMC to secure capacity for more than 300,000 Maia 300 AI chips in 2027. The reported plan to lift output to about 1 million units next year underscores a deeper push into custom AI silicon.
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