Seok-Hee Lee joins Intel as EVP, @​Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innov

Seok-Hee Lee joins Intel as EVP, @​Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation. Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement, and the end-to-end cu…